Supports Intel® Core™ Duo Low Voltage or Core™2 Duo Ultra Low Voltage mobile processor
Intel® 945GME chipset supports 533/667 MHz FSB
Up to 3 GB (DDR2 533/667) memory with SODIMM expansion
Conduction cooled with ANSI/VITA30.1-2002 compliancy
Pre-heat circuitry for reliable cold-booting in low temperature environment, or optional support for IPMI v1.5 without pre-heat
Boot from network, Compact Flash, or local 2.5" SATA HDD
Four GbE ports, two USB 2.0 ports, two DVI-I ports, one P/S2 port, and one COM interface to the Rear Transition Module
Optional one VGA port and two USB 2.0 ports to front panel
Optional conformal coating and SODIMM gluing service
PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.6 R1.0 compliant